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用于降低接触热阻的复合黏结材料的制备优化
引用本文:董震,杨永鲁,熊国栋,赖艳华,吕明新.用于降低接触热阻的复合黏结材料的制备优化[J].山东大学学报(工学版),2017,47(3):143-150.
作者姓名:董震  杨永鲁  熊国栋  赖艳华  吕明新
作者单位:1. 山东大学苏州研究院, 江苏 苏州 215028;2.山东大学能源与动力工程学院, 山东 济南 250061
基金项目:苏州市科技发展计划资助项目(ZXG201443);国家自然科学基金资助项目(51476093);山东省科技发展计划资助项目(2013GGX10403)
摘    要:基于提高吸附床的导热性能,研制一种可涂于吸附床与吸附剂之间降低接触热阻的耐高温耐腐蚀的高导热复合黏结材料。通过稳态试验研究导热填料、稀释剂与偶联剂等因素对复合黏结材料热导率的影响,采用正交试验方法优化复合黏结材料的配制方案。研究结果表明:复合黏结材料的导热性能随着Al_2O_3导热填料的质量分数的增加而提高,采用10μm Al_2O_3导热填料粒子的导热性能略高于采用35μm Al_2O_3导热填料粒子的复合黏结材料,10μm Al_2O_3导热填料粒子用质量分数8%的偶联剂处理,复合黏结材料的热导率最高。采用适当配比的导热填料、稀释剂与偶联剂能显著提高复合黏结材料的热导率。

关 键 词:接触热阻  优化制备  复合黏结材料  热导率  正交试验  
收稿时间:2017-01-16

Preparation and optimization of compound bonded material used in reducing the contact thermal resistance
DONG Zhen,YANG Yonglu,XIONG Guodong,LAI Yanhua,LYU Mingxin.Preparation and optimization of compound bonded material used in reducing the contact thermal resistance[J].Journal of Shandong University of Technology,2017,47(3):143-150.
Authors:DONG Zhen  YANG Yonglu  XIONG Guodong  LAI Yanhua  LYU Mingxin
Affiliation:1. Suzhou Institute, Shandong University, Suzhou 215028, Jiangsu, China;2. School of Energy and Power Engineering, Shandong University, Jinan 250061, Shandong, China
Abstract:To enhance the global thermal conductivity of adsorbed bed, heating resistingand corrosion-resistant composite bonded material with high thermal conductivity was studied. It could be daubed between adsorbed bed and adsorbent for decreasing thermal contact resistance.The article experimental researched the influence of thermal conducting filler, diluent and coupling reagent and other factors on composite bonded materials thermal conductivity at first. And then confecting project of composite bonded material with orthogonal experiment was optimized. The research results showed that the thermal properties of the compositebonded material improved with the percentage of thethermal conducting filler Al2O3 increasing, composites with 10 μm Al2O3 fillers had better thermal performance than the composites with 35 μm Al2O3fillers.For 10 μm Al2O3 fillers, which treated by 8% concentration coupling agent had the highest thermal conductivity.The thermal conductivity of the composites could be significantly improved by using the appropriate ratio of the thermal conductive fillers, diluents and coupling agents.
Keywords:compositebonded material  thermal conductivity  thermal contact resistance  preparationoptimization  orthogonal experiment  
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