| 化学镀镍工艺中添加剂的研究 |
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| 引用本文： | 任志华,张积树,王芳,高承津.化学镀镍工艺中添加剂的研究[J].青岛科技大学学报,1996(4). |
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| 作者姓名： | 任志华 张积树 王芳 高承津 |
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| 摘 要： | 采用酸性化学镀液制备了Ｎｉ－Ｐ合金镀层。研究了几种添加剂对镀速的影响，并讨论了添加剂对改善镀层光亮性、针孔以及镀层磷含量所起的作用。
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| 关 键 词： | 化学镀Ni－P合金镀层 添加剂 镀速 光亮度 |
Additives of Electroless Plating of Nickel |
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| Ren Zhihua,Zhang Jisu,Wang Fang ,Gao Chenglin.Additives of Electroless Plating of Nickel[J].Journal of Qingdao University of Science and Technology:Natutral Science Edition,1996(4). |
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| Authors: | Ren Zhihua Zhang Jisu Wang Fang Gao Chenglin |
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| Affiliation: | Ren Zhihua;Zhang Jisu;Wang Fang ;Gao Chenglin(Department of Applied Chemisty) (Service Centre of Science and Education) |
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| Abstract: | Ni-P alloy coatings were deposited with acid electroless plating haths. The effect ofseveral additives and brighteners on plating rate were studied,and the action of additives in improvingthe brightness,poresity and phosphor content of the coatings were also discussed. |
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| Keywords: | electroless plating of Ni-P alloy additives plating rate brightness |
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