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Flow stress behavior and processing map of Al-Cu-Mg-Ag alloy during hot compression
Authors:Sheng Yang  Danqing Yi  Hong Zhang  Sujuan Yao
Affiliation:[1]School of Materials Science and Engineering, Central South University, Changsha 410083, China [2]Zhengzhou Research Institute of CHALCO, Zhengzhou 450041, China
Abstract:The hot deformation behavior of Al-Cu-Mg-Ag was studied by isothermal hot compression tests in the temperature range of 573-773 K and strain rate range of 0.001-1 s-1 on a Gleeble 1500 D thermal mechanical simulator. The results show the flow stress of Al-Cu-Mg-Ag alloy increases with strain rate and decreases after a peak value, indicating dynamic recovery and recrystallization. A hyperbolic sine relationship is found to correlate well the flow stress with the strain rate and temperature, the flow stress equation is estimated to illustrate the relation of strain rate and stress and temperature during high temperature deformation process. The processing maps exhibit two domains as optimum fields for hot deformation at different strains, including the high strain rate domain in 623-773 K and the low strain rate domain in 573-673 K.
Keywords:Al-Cu-Mg-Ag alloy  flow stress behavior  constitutive equation  processing map
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