| 甲基磺酸- 双氧水体系对印刷电路板拆解技术 |
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| 引用本文： | 张晓娇,郭耀广,张承龙,关杰.甲基磺酸- 双氧水体系对印刷电路板拆解技术[J].上海第二工业大学学报,2018(2):94-97. |
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| 作者姓名： | 张晓娇 郭耀广 张承龙 关杰 |
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| 作者单位： | 上海第二工业大学电子废弃物研究中心;上海第二工业大学上海电子废弃物资源化协同创新中心;上海第二工业大学资源循环科学与工程中心;上海第二工业大学环境与材料工程学院 |
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| 基金项目： | 上海第二工业大学校基金项目(EGD17XQD09), 上海第二工业大学飞跃计划(EGD18XQD24), 上海第二工业大学重
点培育学科(XXKPY1601), 上海第二工业大学重点学科建设项目(XXKZD1602), 上海市高原学科-环境科学与工程
(资源循环科学与工程) (A30DB182602) 资助 |
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| 摘 要： | 废印刷电路板上元器件的拆解技术是电路板资源化再利用的重要环节。通过研究甲基磺酸-双氧水体系下元器件的脱落率,得出优化的实验条件为:甲基磺酸浓度范围为3.0～3.5 mol/L,双氧水浓度范围为0.4～0.6 mol/L,反应时间45 min。在该实验条件下,实验样品中焊接元器件脱落率达到100%,实现了电路板基板与元器件的快速高效分离,为废旧电路板上元器件的拆解技术提供一定的技术支撑。
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| 关 键 词： | 电子废弃物 印刷电路板 拆解 脱落率 甲基磺酸 |
Study on Dismantling of Waste Printed Circuit Board under
CH4O3S-H2O2 System |
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| ZHANG Xiao-jiao,GUO Yao-guang,ZHANG Cheng-long and GUAN Jie.Study on Dismantling of Waste Printed Circuit Board under
CH4O3S-H2O2 System[J].Journal of Shanghai Second Polytechnic University,2018(2):94-97. |
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| Authors: | ZHANG Xiao-jiao GUO Yao-guang ZHANG Cheng-long and GUAN Jie |
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| Affiliation: | (a. WEEE Research Center; b. Shanghai Collaborative Innovation Center for WEEE Recycling; d. Research Center of Resource Recycling Science and Engineering,
Shanghai Polytechnic University, Shanghai 201209, China,c. School of
Environmental and Materials Engineering; d. Research Center of Resource Recycling Science and Engineering,
Shanghai Polytechnic University, Shanghai 201209, China,(a. WEEE Research Center; b. Shanghai Collaborative Innovation Center for WEEE Recycling; d. Research Center of Resource Recycling Science and Engineering,
Shanghai Polytechnic University, Shanghai 201209, China and c. School of
Environmental and Materials Engineering; d. Research Center of Resource Recycling Science and Engineering,
Shanghai Polytechnic University, Shanghai 201209, China |
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| Abstract: | The dismantling technology of waste printed circuit board is an important part of the circuit board treatment. Through
the study of removal rate of components under CH4O3S-H2O2 system, the optimum experimental conditions were as follows: the
concentration of methyl sulfonate was 3.0-3.5 mol/L, the concentration of hydrogen peroxide was 0.4-0.6 mol/L, and the reaction time
was 45 min. Under the experimental conditions, the removal rate of components reached 100% and realized the rapid separation of the
circuit board components, which provides technical support for the industrial disassembly of the waste printed circuit boards. |
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| Keywords: | electronic waste printed circuit board dismantling removal rate methyl sulfonic acid |
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