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LED 封装领域专利技术分析及预警研究
引用本文:张涛,范广涵,许毅钦,贺龙飞,喻晓鹏,熊建勇.LED 封装领域专利技术分析及预警研究[J].照明工程学报,2014(4):100-105.
作者姓名:张涛  范广涵  许毅钦  贺龙飞  喻晓鹏  熊建勇
作者单位:华南师范大学光电子材料与技术研究所,广东省微纳光子功能材料与器件实验室,广东广州510631
基金项目:广东省战略性新兴产业项目“LED产业专利信息资源开发丁程”(编号:2011-IP-06)
摘    要:通过分析LED封装领域专利技术现状、研究热点、重点技术及我国LED封装领域专利技术存在的问题,归纳了对中国LED封装领域形成专利壁垒的核心技术专利,并对封装领域核心技术进行深度分析及预警。

关 键 词:LED  封装  专利分析  预警

Study of Patent Technology Analysis and Early Warning in the LED Packaging Field
Zhang Tao,Fan Guanghan,Xu Yiqin,He Longfei,Yu Xiaopeng,Xiong Jianyong.Study of Patent Technology Analysis and Early Warning in the LED Packaging Field[J].China Illuminating Engineering Journal,2014(4):100-105.
Authors:Zhang Tao  Fan Guanghan  Xu Yiqin  He Longfei  Yu Xiaopeng  Xiong Jianyong
Affiliation:(Laboratory of Nanophotonic Functional and Device, Institute of Opto-electronic Materials and Technology, South China Normal University, Guangzhou 510631, China)
Abstract:This paper sums up the core patents that form the patent barriers to the China 's LED packaging field.It carries out the deep analysis and early warning through the analysis of present situation of patent technology , key technologies , and the existing problems in the LED packaging field in our country .
Keywords:LED  packaging  patent analysis  early warning
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