| 基于改进IMC的磁头微焊点寿命预测模型研究 |
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| 引用本文： | 肖祥慧,唐荣军,周影良.基于改进IMC的磁头微焊点寿命预测模型研究[J].磁性材料及器件,2017,48(5). |
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| 作者姓名： | 肖祥慧 唐荣军 周影良 |
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| 作者单位： | 1. 佛山科学技术学院 自动化学院,广东佛山,528500;2. 日本TDK集团(SAE),广东东莞,523000 |
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| 基金项目： | 欧洲ERASMUS资助项目，湖南省教育厅科学研究项目 |
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| 摘 要： | 磁头无铅微焊点寿命预测方法主要采用疲劳模型,由于磁头焊点十分小,传统的寿命预测方法很难取得较好效果,本文融合金属间化合物生长动力学理论,提出了一种新的用于预测磁头无铅微焊点寿命的生长模型。对比结果表明,新模型预测磁头无铅微焊点寿命与实际结果更加接近。
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| 关 键 词： | 磁头 微焊点 寿命预测 模型 |
The research to the micro solder joint of magnetic head for its lifetime rediction model based on IMC |
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| XIAO Xiang-hui,TANG Rong-jun,ZHOU Ying-liang.The research to the micro solder joint of magnetic head for its lifetime rediction model based on IMC[J].Journal of Magnetic Materials and Devices,2017,48(5). |
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| Authors: | XIAO Xiang-hui TANG Rong-jun ZHOU Ying-liang |
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| Abstract: | Fatigue model is mainly used for lifetime prediction of micro solder joint (MSJ) of the magnetic head Moreover, for the solders are more and more small, the traditional method of lifetime prediction is difficult to achieve better results. Combining intermetallic compound (IMC) growth theory, this thesis puts forward a new growth model to predict the life expectancy for solder joint of magnetic head. The comparison results show that the predicted solder lifetime is closer to the actual results. |
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| Keywords: | magnetic head micro solder joint lifetime prediction moedel |
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