| 低温共烧结陶瓷(LTCC):特点、应用及问题 |
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| 引用本文： | 钟慧,张怀武.低温共烧结陶瓷(LTCC):特点、应用及问题[J].磁性材料及器件,2003,34(4):33-35,42. |
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| 作者姓名： | 钟慧 张怀武 |
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| 作者单位： | 电子科技大学,微电子与固体电子学院,四川成都,610054 |
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| 摘 要： | 与传统的封装技术相比，LTCC技术因其具有优良的高频特性、小线宽和低阻抗而倍受瞩目，现已迅速发展并应用于各领域。LTCC技术是将四大无源器件(电感L、电阻R、变压器T、电容C)和有源器件(晶体管、IC电路模块、功率MOS)集成在一起的混合集成技术。LTCC技术的应用可以取代目前的PCB板，使系统趋于小型化和稳定化。本文介绍LTCC技术的发展历史、研究现状、应用前景等，并着重介绍LTCC技术的分类、市场情况，也分析了LTCC技术的局限性。
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| 关 键 词： | 低温共烧结陶瓷（LTCC） 片式无源器件 |
| 文章编号： | 1001-3830(2003)04-0033-03 |
LTCC Technology:Characteristics,Applications and Problems |
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| ZHONG Hui,ZHANG Huai-wu Institute of Microelectronics and Solid Electronics,University of Electronic Science and Technology,Chengdu ,China.LTCC Technology:Characteristics,Applications and Problems[J].Journal of Magnetic Materials and Devices,2003,34(4):33-35,42. |
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| Authors: | ZHONG Hui ZHANG Huai-wu Institute of Microelectronics and Solid Electronics University of Electronic Science and Technology Chengdu China |
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| Affiliation: | ZHONG Hui,ZHANG Huai-wu Institute of Microelectronics and Solid Electronics,University of Electronic Science and Technology,Chengdu 610054,China |
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| Abstract: | The low temperature co-fired ceramics (LTCC) technology has advantage over other traditional packing technologies for its excellent high frequency characteristics, fine line and spaces, low resistance metallization. Integrations of four passive devices (such as L, R, T, C) and active devices (such as transistor, IC module and power MOS) to the hybrid IC can be achieved by LTCC technology. Here we introduced the history, present condition and foreground, especially its classification, market and limitations. |
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| Keywords: | low temperature co-fired ceramic(LTCC) planar passive devices |
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