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电力电子集成模块中压接结构及其电接触特性
引用本文:何晓宇,曾翔君,杨旭,王兆安.电力电子集成模块中压接结构及其电接触特性[J].中国电机工程学报,2008,28(9):50-54.
作者姓名:何晓宇  曾翔君  杨旭  王兆安
作者单位:西安交通大学电气工程学院,陕西省,西安市,710049
摘    要:提出了一种在电力电子集成模块内使用的簧片压接互连工艺,该工艺具有很高的长期可靠性,核心是使用铍青铜制作的弹簧,该弹簧不仅提供足够的压接力,同时还实现可靠的电气连接。压接工艺具有十分优良的抵抗热应力的能力,并且工艺流程也很简单。研究了压接工艺的电接触特性。基于该工艺研制了一个4 kW的半桥集成模块,并通过温度循环实验和功率考核实验证明了工艺的可行性。

关 键 词:电力电子集成模块  压接互连方式  铍青铜  电接触
文章编号:0258-8013(2008)09-0050-05
收稿时间:2006-09-14
修稿时间:2007年6月1日

Pressure Contact Structure and Electrical Contact Propoerty of Integrated Power Electronic Module
HE Xiao-yu,ZENG Xiang-jun,YANG Xu,WANG Zhao-an.Pressure Contact Structure and Electrical Contact Propoerty of Integrated Power Electronic Module[J].Proceedings of the CSEE,2008,28(9):50-54.
Authors:HE Xiao-yu  ZENG Xiang-jun  YANG Xu  WANG Zhao-an
Abstract:This paper presents a novel pressure contact interconnect technique in integrated power electronic module (IPEM) with high reliability. The central component of this technique is a break spring made of BeCu alloy. The break spring not only provides enough press-contact force, but also implements electrical interconnection. The technique exhibits excellent ability of withstanding thermal stress, and is also manufactured with a very simple process. Contact resistance of the pressure contact structure is investigated. A half-bridge IPEM based on pressure contact technique is proposed. Thermal cycling and power experiments were carried out, and the break spring pressure contact technique is verified to be feasible.
Keywords:integrated power electronic module  pressure contact interconnect technique  beryllium-copper alloy  electrical contact
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