一种微带线到带状线宽带垂直耦合过渡结构

针对基于微波多层介质板的微带线到带状线过渡问题，提出了一种微带线到带状线宽带垂直耦合过渡结构，通过地层的圆形开孔完成微带线与带状线椭圆形贴片间的电磁耦合与匹配设计，实现了微波信号在微波多层介质板内跨层传输。将微带线到带状线宽带垂直耦合过渡结构在三维电磁场仿真软件中进行了建模，并对背对背结构进行了仿真、加工与测试。测试结果表明，在7~13 GHz的频带范围内输入输出回波损耗小于-12 dB，插入损耗最小为1.48 dB。该微带线到带状线宽带垂直耦合过渡结构具备了良好的性能，同时具有电路结构简单、加工方便等特点，在微波电路设计方面具有较高的实用价值。

Broadband vertical microstrip to stripline transition via electromagnetic coupling

Aiming at microstrip to stripline transition in multi layer designs,a broadband vertical microstrip to stripline transition via electromagnetic coupling is proposed. In this designs, microstrip to stripline transition is formed by two elliptically patches, which are broadside coupled and matched through circular slots,and then realizes the transmission of microwave signal in different layers. The proposed structure is designed by software and the back to back transition is simulated, fabricated and tested. The measurements of the designed devices exhibit that the return loss in the order of 12 dB or better and the best insert loss is 1.48 dB. The results show that this proposed structure has a good performance, and the structure is simple and the processing is convenient and so on. All this indicates the structure has a good applicable worthiness in microwave circuit designs.