| 我国大功率LED封装专利现状 |
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| 引用本文： | 李君飞,张宏,蒙文体.我国大功率LED封装专利现状[J].灯与照明,2010,34(2):37-39. |
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| 作者姓名： | 李君飞 张宏 蒙文体 |
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| 作者单位： | 1. 四川九洲光电科技有限公司,绵阳,621000
2. 四川九洲电器集团有限责任公司,绵阳,621000 |
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| 摘 要： | 大功率白光LED使半导体照明走进千家万户成为了可能。针对目前行业无统一标准的现状,各企业和科研机构都通过申请专利来保护自己的技术,该文结合现有专利的申请情况,阐述了大功率白光LED的荧光粉涂覆技术、散热技术以及多晶片封装技术等方面的专利现状,并在此基础上提出了下一阶段大功率LED封装可能的发展方向。
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| 关 键 词： | 大功率白光LED 专利 封装 现状 |
The Actuality of Patent on High-power LED Packaging |
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| Li Junfei,Zhang Hong,Meng Wenti.The Actuality of Patent on High-power LED Packaging[J].Light & Lighting,2010,34(2):37-39. |
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| Authors: | Li Junfei Zhang Hong Meng Wenti |
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| Affiliation: | 1. Sichuan Jiuzhou Photoelectronic Technology Co. ,Ltd,Mianyang 621000; 2. Sichuan Jiuzhou Electric Group Co. ,Ltd, Mianyang 621000) |
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| Abstract: | Because of having no uniform standard for SSL industry, all corporations and research organizations protect their technologies by applying for patent. In this paper, the technologies of phosphor-coating, disperse-heat, packaging of multi-chip and so on were expounded, then, the possible development of power LED packaging was advanced. |
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| Keywords: | power-white LED patent packaging actuality |
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