| CuW触头材料的制备 |
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| 引用本文： | 陈世俊,段沛林.CuW触头材料的制备[J].电工材料,2011(1):27-30. |
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| 作者姓名： | 陈世俊 段沛林 |
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| 作者单位： | 北京尚华扬电子技术开发有限公司,北京,100018 |
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| 摘 要： | 介绍了利用液-固润湿性制备两种CuW触头材料的工艺。利用液-固润湿性制备一端有细槽的CuW触头材料,可消除带凹槽CuW触头材料中Cu在凹槽中的堆积,解决凹槽中Cu难以去除的问题;利用液-固润湿性制造大径薄壁的CuW触头材料,可减少设备、模具的投入,从而大大降低产品成本,满足市场需求。
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| 关 键 词： | 液-固润湿性 CuW触头材料 工艺 |
Preparation of CuW Contact Materials |
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| CHEN Shi-jun,DUAN Pei-lin.Preparation of CuW Contact Materials[J].Electrical Engineering Materials,2011(1):27-30. |
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| Authors: | CHEN Shi-jun DUAN Pei-lin |
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| Affiliation: | CHEN Shi-jun,DUAN Pei-lin(Beijing Shinewinner Electronics Technology Empolder Co.Ltd.Beijing 100018,China) |
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| Abstract: | Processes to prepare two kinds of CuW contact material using liquid-solid wettability were presented.The application of this method in making CuW contact material with micro-channel at one end can prevent accumulation of copper in the channel of CuW contact material and thus solve the removal problem of copper.Large diameter and thin shell CuW contact material manufactured in this way may need lesser investment on equipment and die and thus the product cost can be greatly reduced. |
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| Keywords: | liquid-solid wettability CuW contact material process |
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