| AuSn20焊料制备技术及发展趋势 |
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| 引用本文： | 孙晓亮,马光,李银娥,刘啸锋.AuSn20焊料制备技术及发展趋势[J].电工材料,2010(3):9-11. |
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| 作者姓名： | 孙晓亮 马光 李银娥 刘啸锋 |
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| 作者单位： | 西北有色金属研究院,西安,710016 |
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| 摘 要： | 随着电子产品小型化、无铅化的发展,对焊接材料提出了更高的要求。无铅焊料AuSn20由于具有优良的性能,在高可靠性气密封装和芯片焊接中被广泛应用。本文介绍了AuSn20焊料的性能和制备方法,指出了传统的铸造拉拔轧制法、叠层冷轧复合法及电镀沉积法的不足,提出了研究及制备AuSn20合金焊料的技术改进方案。
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| 关 键 词： | 无铅化 AuSn20焊料 制备 技术改进 |
Application and Development Trend of AuSn20 Solder |
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| SUN Xiao-liang,MA Guang,LI Yin-e,LIU Xiao-feng.Application and Development Trend of AuSn20 Solder[J].Electrical Engineering Materials,2010(3):9-11. |
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| Authors: | SUN Xiao-liang MA Guang LI Yin-e LIU Xiao-feng |
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| Affiliation: | SUN Xiao-liang,MA Guang,LI Yin-e,LIU Xiao-feng(Northwest Institute for Nonferrous Metal Research,Xi'an 710016,China) |
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| Abstract: | With the development of miniaturization and lead-free of electronic products,high demand is put forward about solder.Lead free solder AuSn20 is widely applied in high reliable hermetic package and die welding due to excellent mechanical property.This paper described the properties and preparation of AuSn20 solder,pointed out the disadvantages of the conventional drawing and rolling process,casting process and laminose composite process of cold rolling,put out improve programes of research and preparation fo... |
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| Keywords: | lead free AuSn20 solder preparation technology improvement |
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