| 引线框架用高强高导铜合金材料 |
| |
| 引用本文： | 于朝清.引线框架用高强高导铜合金材料[J].电工材料,2005(2):33-37,43. |
| |
| 作者姓名： | 于朝清 |
| |
| 作者单位： | 重庆川仪一厂,重庆,400702 |
| |
| 摘 要： | 高强高导铜合金材料是集成电路和电子元器件发展的基础。铜合金材料具有优良的导电导热性能，而且价格相对低廉．在集成电路封装领域应用广泛。在不过分降低其导电导热性能的前提下，可采取多种强化方式来提高新型合金材料的综合性能，以满足集成电路封装技术发展的需要。本文概述了引线框架用高强高导铜合金材料的种类、研究现状及应用前景。
|
| 关 键 词： | 高强高导 铜合金 弥散强化 沉淀强化 |
| 文章编号： | 1671-8887(2005)02-0033-06 |
The Summary of Copper Alloy with High-strength and High-conductivity |
| |
| YU Chao-qing.The Summary of Copper Alloy with High-strength and High-conductivity[J].Electrical Engineering Materials,2005(2):33-37,43. |
| |
| Authors: | YU Chao-qing |
| |
| Abstract: | The copper alloy with high-strength and high-conductivity is base of IC and electronic element development.The copper alloy has not only excellent electrical and thermal conductivity,but also it is low cost.So it is widely used in integrated circuits.It is a common subject that improving properties of new alloy in many strengthening meth-ods without decreasing electrical and thermal conductivity in order to meet integrated cir-cuit industry's need. |
| |
| Keywords: | high-strength and high-conductivity copper alloy dispersion strengthening pre-cipitation strengthening |
| 本文献已被 CNKI 维普 万方数据 等数据库收录！ |
