| 基于2-D彩色图像模型的PCB焊点检测方法研究 |
| |
| 引用本文： | 吴福培.基于2-D彩色图像模型的PCB焊点检测方法研究[J].电测与仪表,2011,48(1):18-20,5. |
| |
| 作者姓名： | 吴福培 |
| |
| 作者单位： | 汕头大学工学院机电系;汕头轻工装备研究院; |
| |
| 基金项目： | 国家自然科学基金(60774019); 广东省自然科学基金重点项目(2006D930304001); 广东省科技计划重大专项(2009A080201004,2010A080402010); 汕头大学科研启动项目(09400109) |
| |
| 摘 要： | 提出了一种基于2-D彩色图像模型的PCB焊点检测方法.首先,基于3色LED环形结构光源和彩色数字相机的图像采集子系统获取的彩色PCB图像,分析了片式晶片元器件焊点表面信息与其焊点图像色彩分布规律,建立了片式晶片良品焊点类型的焊点检测模型,其次,给出了反映可接受焊点图像中心感兴趣区域(ROI)色彩分布规律的灰度曲线图.在...
|
| 关 键 词： | 自动光学检测 焊点检测 焊点检测模型 灰度曲线图 |
Research on Inspection Method of Printed Circuit Board's Solder Joint Based on 2-D Model of Color Image |
| |
| WU Fu-pei.Research on Inspection Method of Printed Circuit Board's Solder Joint Based on 2-D Model of Color Image[J].Electrical Measurement & Instrumentation,2011,48(1):18-20,5. |
| |
| Authors: | WU Fu-pei |
| |
| Affiliation: | WU Fu-pei1,2(1.Department of Mechatronic Engineering,Shantou University,Shantou 515063,Guangdong,China.2.Shantou Institute for Light Industrial Equipment Research,China) |
| |
| Abstract: | An inspection method of printed circuit board's solder joint based on 2-D model of color image is presented.Based on the solder joint images,which are acquired by a 3 color LED ring structure illuminator and a 3-CCD color digital camera,the relationship between the surface information of solder joint and the color distributing rules of solder joint image is analyzed,and the solder joint inspection model is built for the acceptable solder joint of chip.Then gray-scale curve graph,which reflects the color dis... |
| |
| Keywords: | Automatic Optical Inspection(AOI) system solder joint inspection inspection model of solder joint gray-scale curve graph |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
