| 微小芯片粘贴系统的拾取误差校正 |
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| 引用本文： | 刘轩,汤建华,黄波.微小芯片粘贴系统的拾取误差校正[J].微计算机信息,2005(21). |
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| 作者姓名： | 刘轩 汤建华 黄波 |
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| 作者单位： | 长春光学精密机械与物理研究所，长春光学精密机械与物理研究所，长春光学精密机械与物理研究所 中国科学院研究生院 |
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| 摘 要： | 为达到微小芯片粘贴系统高精度的性能要求,以二极管粘片机为例在系统分析微小芯片粘贴系统运动控制的各误差因素的基础上,提出了误差校正的方法。特别针对微小芯片粘贴系统的高精度要求,采用了全闭环控制、视觉定位等先进技术。校正方法在具体工作中校正效果良好,对精度提高作用很大。
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| 关 键 词： | 误差校正 运动控制 视觉定位 粘片机 |
Error Adjusting for Picking Up of Microchip Bonding System |
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| Liu,Xuan Tang,Jianhua Huang,Bo.Error Adjusting for Picking Up of Microchip Bonding System[J].Control & Automation,2005(21). |
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| Authors: | Liu Xuan Tang Jianhua Huang Bo |
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| Abstract: | In order to fulfill high demand of precision in the microchip bonding system. Based on the analysis of every error in the system, the paper presents t he method for error adjusting. And aiming especially at the high demand of preci sion, the advanced technology of full closed loop control and visual locating has been carried out. The method has been proved very efficient for adjusting in the practical project and greatly improves the precision of system. |
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| Keywords: | error adjusting movement control visual locating die bonder |
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