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一种柔性三维力触觉传感器阵列的实现方法
引用本文:张正勇,孔德义,梅涛,单建华,倪林,孙磊,吕晓庆,孟庆虎.一种柔性三维力触觉传感器阵列的实现方法[J].传感技术学报,2007,20(11):2382-2385.
作者姓名:张正勇  孔德义  梅涛  单建华  倪林  孙磊  吕晓庆  孟庆虎
作者单位:中国科学院合肥智能机械研究所,合肥,230031
基金项目:国家高技术研究发展计划(863计划)
摘    要:介绍了一种可安装在曲面上,对三维力进行检测的柔性三维力触觉传感器阵列的实现方法.首先采用MEMS技术制备三维力触觉传感器阵列,再将多个三维力触觉传感器单元分别通过倒装焊技术集成在已加工好的柔性电路板基底上,实现了传感器与信号处理电路的互连和传感器阵列(4×4)的柔性化.采用信号选通的多路信号采集方法简化了传感器阵列的信号处理电路.测试结果表明,柔性触觉传感器阵列可弯曲变形90°以上,检测三维力的分辨率达到0.1 N.

关 键 词:MEMS技术  柔性三维力触觉传感器阵列  倒装焊技术  多路信号选通
文章编号:1004-1699(2007)11-2382-04
修稿时间:2007年3月28日

The Preparation Method of A Flexible Tactile Sensors Array for three-dimensional force measurement
ZHANG zheng-yong,KONG de-yi,MEI tao,SHAN jian-hu,NI lin,SUN lei,LV xiao-qing,MENG qing-hu.The Preparation Method of A Flexible Tactile Sensors Array for three-dimensional force measurement[J].Journal of Transduction Technology,2007,20(11):2382-2385.
Authors:ZHANG zheng-yong  KONG de-yi  MEI tao  SHAN jian-hu  NI lin  SUN lei  LV xiao-qing  MENG qing-hu
Affiliation:Hefei institute of Intelligent Machins, CAS
Abstract:This paper described a process method of flexible three-dimensional force tactile sensor array that may install in the curved surface. First, the three-dimensional force tactile sensor array be made by MEMS technology. Second, many three-dimensional force tactile sensor unit separately be integrated on the flexible PCB by flip chip technology. This process has realized the interlink of the sensor and signal processing electric circuit unit, and flexibility of the sensor array (4×4). Uses the multichannel signal elects to pass to simplify the sensor array signal processing electric circuit. The test result indicated that, the flexible three-dimensional force tactile sensor array may bending strain above 90o, the detection three dimensional foece limit achieve 0.1N.
Keywords:MEMS technology  flexible three-dimensional force tactile sensor array    flip chip technology  the multichannel signal elects to pass
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