| PVD溅射技术在MEMS器件制作中的应用 |
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| 引用本文： | 王雄,吴学忠.PVD溅射技术在MEMS器件制作中的应用[J].传感技术学报,2006,19(5):1434-1436,1440. |
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| 作者姓名： | 王雄 吴学忠 |
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| 作者单位： | 国防科技大学机电工程与自动化学院,长沙,410073 |
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| 摘 要： | 简单介绍了PVD溅射系统和溅射原理.实验分析了PVD溅射技术在微晶玻璃基片溅射沉积Cu膜时,沉积速率随相关工艺参数变化而变化的几点规律.给出了用PVD溅射技术沉积的Cu膜的表面形貌(AFM)图和显微镜照片.
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| 关 键 词： | 微机电系统 PVD溅射 薄膜沉积速率 原子力显微镜 |
| 文章编号： | 1004-1699(2006)05-1434-03 |
| 修稿时间： | 2006年7月1日 |
PVD sputtering technology and it's application on MEMS |
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| Wang Xiong,Wu Xue-zhong.PVD sputtering technology and it''s application on MEMS[J].Journal of Transduction Technology,2006,19(5):1434-1436,1440. |
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| Authors: | Wang Xiong Wu Xue-zhong |
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| Abstract: | A PVD sputtering system and its principle is shown. Some Cu films were sputtered by this sputtering system. Based on these experiments, some common relationships are educed between deposition rate and some different factors. At the same time, a AFM picture of Cu film is shown. |
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| Keywords: | MEMS PVD sputtering film deposition rate AFM |
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