三维微弹簧型MEMS探卡的设计和制备

随着IC器件上的I/O尺寸减小和密度增加,与之通过接触来进行电性能测试的探卡密度也要相应增加,传统手工制作的环氧树脂针形探卡难以满足使用要求,使用MEMS技术制作探卡成为发展的趋势,但是当前MEMS探卡的主要问题是不能承受和产生破坏焊垫表面氧化层和污染层所需的应力.本文提出了一种简支梁结构、通过多次电镀工艺制作的三维弹性MEMS探卡,这种探卡可以承受更大应力,并且具有较小的自身电阻.针对间距为250 μm阵列排布的器件I/O,使用ANSYS有限元方法对弹簧型探卡进行了结构分析和设计,采用UV-LIGA工艺制备探卡,最后对探卡的力学性能进行了测试.

The design and fabrication of 3D micro spring type MEMS probe card

As I/O electrodes of IC devices become smaller and high-density, probe cards which contact the I/O pads and test the electrical properties should follow the trend. Traditional needle/epoxy ring probe cards can not meet the requirements, fabricating probe cards by using MEMS technology should be a promising method. However, the critical problem of MEMS probe cards is that they can not endure and produce a force needed to break surface oxidation layer or contamination layer. This paper proposed an elastic 3D MEMS probe card with freely supported beam structure fabricated by multi-electroplating. This probe cards can endure large force with small electric resistance. The structure of spring-type probe cards was designed for 250 ?m-pitch array I/O electrodes by ANSYS finite element method and fabricated by UV-LIGA technology. Last, the mechanical property of this probe card was measured.