| 电子设备强迫风冷散热特性测试与数值仿真 |
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| 引用本文： | 陈国强,朱敏波.电子设备强迫风冷散热特性测试与数值仿真[J].计算机辅助工程,2008,17(2):24-26. |
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| 作者姓名： | 陈国强 朱敏波 |
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| 作者单位： | 西安电子科技大学,机电工程学院,西安,710071 |
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| 摘 要： | 针对电子设备发热导致其可靠性下降的问题，对某电子设备机箱内部PCB（Printed Circuit Board）板强迫风冷的散热特性进行热测试实验，利用热分析软件ICEPAK对该设备的工作情况进行热仿真，并比较实验结果和仿真结果，结果表明二者一致性较好．分析数值仿真产生误差的因素并提出改进数值仿真的方法．该研究表明数值仿真可以为电子设备的热设计开发提供依据．
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| 关 键 词： | 热仿真 热测试 电子设备 ICEPAK |
| 收稿时间： | 2007/8/27 0:00:00 |
| 修稿时间： | 2007/10/3 0:00:00 |
Thermal test and numerical simulation on heat transfer characteristics of forced air cooling for electronic equipment |
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| CHEN Guoqiang and ZHU Minbo.Thermal test and numerical simulation on heat transfer characteristics of forced air cooling for electronic equipment[J].Computer Aided Engineering,2008,17(2):24-26. |
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| Authors: | CHEN Guoqiang and ZHU Minbo |
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| Affiliation: | CHEN Guoqiang,ZHU Minbo(School of Mechano-Electronic Eng.,Xidian Univ.,Xi'an 710071,China) |
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| Abstract: | With the heat issues that low the performance of electronic equipment,the thermal tests on heat transfer characteristics of forced air cooling are done for the Printed Circuit Board(PCB) in an electronic equipment.The PCB is thermally simulated using ICEPAK.The comparison indicates that the simulation results have better consistency with the test results.The factors which lead to simulation errors are analyzed and the improved numerical simulation method is presented.It is shown that such numerical simulati... |
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| Keywords: | thermal simulation thermal test electronic equipment ICEPAK |
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