Characterization of a multi-chip microelectrofluidic bench for modular fluidic and electric interconnections

We present the design, fabrication, and characterization of a multi-chip microelectrofluidic bench, achieving both fluidic and electric interconnections with simple and low pressure-loss interconnections. The microelectrofluidic bench provides easy alignment of fluidic interconnection using microfabricated annular fluidic connectors; also provides simple electric interconnection using isotropic conductive adhesives at room temperature. Thus, the present microelectrofluidic bench provides a modular concept for fluidic and electric interconnection. In experimental study, we characterize pressure losses, electric resistances loss, and pressure stability of the interconnection. The average pressure drop per each fluidic contact is measured 0.12 ± 0.19 kPa at the DI water flow rate from 10 to 100 μl min⁻¹. The electric resistance per each electric contact is measured as 0.64 ± 0.29 Ω. The fluidic interconnection endures maximum pressure of 115 ± 11 kPa. The present microelectrofluidic bench, therefore, offers a simple and low pressure-loss electrofluidic modular interconnection for electrofluidic multi-chip microsystems.