有效改善软件过程方法研究

改善软件过程是软件生产和发展软件产业的必由之路。结合目前软件过程工程领域研究现状，研究分析两种软件过程改善的方法：自顶向下和自底向上。自顶向下的方法以CMM模型框架为基础，结合其5层结构指导企业软件过程的改善；自底向上的方法根据企业及其具体软件项目的特点，采取“理解”－“评估”－“打包”的软件过程改善过程，“理解”过程目的是建立软件过程基线，“评估”过程是引进过程变更并评估过程变更造成的影响，“打包”过程是评估成功过程变更得到的经验并形成新的过程规范。最后从软件过程改善目标，软件过程基线、软件过程变更评价、软件过程改善方法等方面对上述两种软件过程改善方法进行比较。

AN EFFECTIVE SOFTWARE PROCESS IMPROVEMENT APPROACH

In this paper，the main challenges of software development and current situation of software process application are introduced, followed by the study of two software process improvement approach, top-down and bottom-up. The top-down approach is based on SW-CMM process framework and directed by its five level structure. The bottom-up is product-based process improvement. There are three sub-processes in bottom-up software process improvement model: “understanding”， “assessing”， and “packaging”. The baseline of software process is established in “understanding” stage. Process changes are imported and their impact is evaluated in “assessing” stage. The successful practices are packaged in the “packaging” stage. Then, the comparisons between two approaches are discussed on four aspects：software process improvement goals, software process baseline, software process change assessing, and software process improvement approach.