| 基于COM的芯片仿真技术研究 |
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| 引用本文： | 唐明董,雷电.基于COM的芯片仿真技术研究[J].计算机应用,2005,25(2):437-439. |
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| 作者姓名： | 唐明董 雷电 |
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| 作者单位： | 1.湖南科技大学计算机科学与工程学院； 2.上海大学自动化系 |
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| 摘 要： | 介绍了利用COM对象来模拟和仿真硬件芯片的结构、功能、特征以及信号的传递方式。针对芯片仿真,提出了一种软芯片模型,实现仿真模型的构件化,提高其重用性,对于系统仿真,构件化软件开发具有一定的应用价值。
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| 关 键 词： | 软芯片 COM 仿真 构件 数据传递 |
| 文章编号： | 1001-9081(2005)02-0437-03 |
Research of chip simulation based on COM |
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| TANG Ming-dong,LEI Dian.Research of chip simulation based on COM[J].journal of Computer Applications,2005,25(2):437-439. |
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| Authors: | TANG Ming-dong LEI Dian |
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| Affiliation: | 1.Department of Computer Science, Hunan University of Science and Technology, Xiangtan Hunan 411201, China; 2. Department of Automation, Shanghai University, Shanghai 200072, China |
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| Abstract: | Using COM as an object to simulate the structure, function, character and signal transfer of chips was introduced. According to chip simulation, the concept of software chip was presented, which can be used to make simulation model component-based and improve its reusability, thus it has some value in application for system simulation and component-based software design. |
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| Keywords: | software chip COM simulation component data transfer |
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