回流焊接温度曲线控制研究

随着集成电路产业的飞速发展,高集成度、高可靠性已经成为行业的新潮流。在这种趋势的推动下,SMT(表面贴装技术)在中国也得到了进一步的推广和发展。很多公司在生产和研发中已经大量应用了SMT工艺和表面贴装元器件。在SMT工艺中回流焊接是核心工艺,因为表面组装PCB设计,焊膏印刷和元器件贴装产生的缺陷,最终都将集中表现在焊接中。因此,如果没有合理可行的回流焊接工艺,前面任何工艺控制都将失去意义。

Discussion About the Control of the Temprature Curve of Circumfluence Soldering

With the rapid development of IC electronics industry,it has become a new trend that the industry has the quality of a high level of integration and high reliability.In the promotion of this trend,SMT(surface-mount technology) have been further promoted and developed in China.Many companies have already introduce the SMT technology and the application of surface-mount components in the manufacturing and design.In SMT technology,circumfluence soldering is the core,because the defect of the PCB design,stencil printing and mount the components,will appear in welding.Therefore,if there is no reasonable and feasible circumfluence soldering technology,the technology control in front will have no meaning.