| MEMS器件中多层金属薄膜溅射工艺研究 |
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| 引用本文： | 张旭,罗昕颉,侯占强,肖定邦,吴学忠.MEMS器件中多层金属薄膜溅射工艺研究[J].传感器与微系统,2018(1):11-14. |
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| 作者姓名： | 张旭 罗昕颉 侯占强 肖定邦 吴学忠 |
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| 作者单位： | 国防科技大学机电工程与自动化学院,湖南长沙,410073
北京大学信息科学技术学院,北京,100871 |
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| 摘 要： | 溅射工艺是制作微机电系统(MEMS)器件金属薄膜的主要方式,金属薄膜作为MEMS器件中的掩模层和功能层,要求薄膜应力小,粘附性、均匀性和可焊性好.通过对常用金属薄膜材料特性、多层金属薄膜溅射工艺和质量评价方法的研究得出了优化工艺的的方法,提高了多层金属薄膜的质量.
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| 关 键 词： | 多层金属薄膜 溅射 评价方法 multilayer metal thin film sputtering evaluation methods |
Sputtering process research of multilayer metal thin film in MEMS devices |
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| ZHANG Xu,LUO Xin-jie,HOU Zhan-qiang,XIAO Ding-bang,WU Xue-zhong.Sputtering process research of multilayer metal thin film in MEMS devices[J].Transducer and Microsystem Technology,2018(1):11-14. |
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| Authors: | ZHANG Xu LUO Xin-jie HOU Zhan-qiang XIAO Ding-bang WU Xue-zhong |
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| Abstract: | Sputtering process is the main way to fabricate metal thin film of micro-electro-mechanical system (MEMS)device.Metal thin film is the mask and functional layer of MEMS device,which requires that the film has small stress,good adhesion,uniformity and weldability.By researching on characteristics of common metal thin film material,sputtering process and quality evaluation methods of multilayer metal thin film,method for process optimizing is obtained,and the quality of multilayer metal thin film is improved. |
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