基于RapidIO的多DSP互联仿真实现

RapidIO协议作为数据通信协议之一在嵌入式系统开发中具有重要作用, 适合短距离, 需要多处理单元合作的应用场景, 例如多DSP构成的板卡系统. BWDSP芯片作为一款高性能数字信号处理器, 其丰富的计算资源在雷达信号处理等领域具有重要潜力. 硬件设计开发中, 直接采用已有数据通信协议很难适配具体硬件资源导致最终产品的数据传输性能较低. 因此需要结合具体硬件模型, 进行数据通信交换模型仿真建模设计, 提高数据传输效率. 本文首先介绍了RapidIO协议和BWDSP体系架构, 然后设计了基于SystemC语言的串行RapidIO交换模型, 最后设计实现了BWDSP虚拟平台. 本文设计的BWDSP虚拟平台功能符合实际RapidIO协议标准, 对硬件产品开发具有一定指导意义.

Realization of Multi DSP Interconnection Simulation Based on RapidIO

RapidIO protocol, as one of the data communication protocols, plays an important role in the development of embedded systems. It is suitable for short-distance application scenarios that require cooperation of multiple processing units, such as the board card system composed of multiple DSPs. As a high-performance digital signal processor, BWDSP chip has great potential in radar signal processing. In the hardware design and development, it is difficult to adapt the specific hardware resources directly using the existing data communication protocol, resulting in the low data transmission performance of the final product. Therefore, it is necessary to combine the specific hardware model to design the simulation model of data communication exchange model, so as to improve the efficiency of data transmission. This study first introduces RapidIO protocol and BWDSP architecture, then designs a serial RapidIO exchange model based on SystemC language, and finally designs and implements BWDSP virtual platform. The functions of BWDSP virtual platform designed in this study are in line with the actual RapidIO protocol standard, which has a certain guiding significance for the development of hardware products.