SIM模块质量分析系统

针对智能卡片生产制造过程中的质量检测问题,提出一种基于SIM的质量的在线视觉检测方案,通过对采集图像光源设计、模块定位以及检测算法的研究,利用图像处理技术中的边缘检测、特征提取、开闭运算和对象识别等关键技术,将打光方案和算法设计相结合,实现了一种利用几何特征匹配的定位算法,用以检测模块中是否有芯片、是否有污物、生锈、条带严重弯曲、花纹断裂、折痕、背面硅胶偏移、硅胶偏厚、报废模块背面硅胶异常凸出、模块条带的定位孔破损等问题.测试结果表明,该系统有效的实现了对SIM卡的质量检测.

Analysis System of SIM Module Quality

To resolve the problem of quality detection in the manufacturing process of smart card, an on-line visual inspection scheme based on SIM is proposed.We present a localization algorithm based on geometric feature matching combining the lighting scheme and algorithm design.It is implemented through the design of image''s light source collection and research of the positioning and detection algorithm of module.Some key technologies, such as edge detection, feature extraction, opening and closing operation and object recognition are used in this algorithm too.It is useful for detecting if there is the chips, and other problems like dirts, rusts, banding severe bending fracture, decorative pattern, crease, silica gel on the back of migration, silica gel thick, scrapped modules silicone abnormal bulge, module stripe location hole on the back of damage, et al.Test results show that the system is an effective implementation of the quality detection of SIM card.