| 基于单片机控制的电镀层厚度记录仪设计 |
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| 引用本文： | 张莉,朱海洋.基于单片机控制的电镀层厚度记录仪设计[J].自动化技术与应用,2010,29(6):96-99. |
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| 作者姓名： | 张莉 朱海洋 |
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| 作者单位： | 广东松山职业技术学院,电气工程系,广东,韶关,512126 |
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| 摘 要： | 电镀层厚度是电镀工艺的重要指标,其与电镀金属材料、电镀电流强度、电镀时间等有关。本文设计的基于单片机的电镀层厚度记录仪,能准确的记录给定电镀金属材料和恒定电流强度的电镀层金属厚度。讨论电镀层厚度形成因素和记录方法,给出系统硬件设计方案和软件流程图。
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| 关 键 词： | 电镀 厚度 单片机 恒流源 数控 |
The Design of Plating Layer Thickness Recorder Based on Microcontroller |
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| ZHANG Li,ZHU Hai-yang.The Design of Plating Layer Thickness Recorder Based on Microcontroller[J].Techniques of Automation and Applications,2010,29(6):96-99. |
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| Authors: | ZHANG Li ZHU Hai-yang |
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| Affiliation: | (Department of Electrical Engineering,Guangdong Songshan Polytechnic College,Shaoguan 512126 China) |
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| Abstract: | To be an important indicator of plating technology,plating layer thickness is associated with metal materials,electroplating current density,plating time etc.The design of microcontroller-based plating layer thickness of recording device in this paper can to record accurately for a given plating metals and constant current intensity of the plating layer of metal thickness.The factors contributing to the thickness of plating and recording methods are discussed,and the system hardware design and software flow chart is given. |
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| Keywords: | Plating Thickness MCU Constant Current Source Digit Control |
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