基于时间约束集的集束型设备群调度方法

随着300mm晶圆的加工技术问世,工业界开始采用一种全新的晶圆制造设备——集束型设备群(Multi-cluster tools).对于单个集束型设备(Single-cluster tools)调度研究已比较成熟,并提出了多种调度方法,然而对于集束型设备群调度研究尚处在一个起步阶段. 本文对带有驻留约束且具有多种晶圆类型的集束型设备群的调度问题进行了研究,在引入时间约束集概念的基础上建立了调度模型, 同时,提出了一种逐级回溯的调度方法，并对调度算法进行了仿真实验分析. 仿真结果表明本文提出的算法是有效且可行的.

Scheduling Algorithm of Multi-cluster Tools Based on Time Constraint Sets

Multi-cluster tools have been used as semiconductor manufacturing equipment since the 300mm diameter wafers appeared. While the throughput analysis and scheduling problems of single-cluster tools have been well-studied, the related researches on multi-cluster tools are still at an early stage. Scheduling problems of multi-cluster tools are analyzed with residency constraints and multi-type wafers in this paper. Firstly, the mathematical model of the problems is constructed on the basis of time constraint sets. Then, a step-back tracking scheduling algorithm is put forward for scheduling multi-cluster tools. Finally, experiments are designed to evaluate the proposed algorithm. The results indicate that the proposed algorithm is feasible and valid.