| 双螺环季戊四醇二膦酸酯环氧树脂的制备,表征及其耐热性能研究 |
| |
| 引用本文： | 隋海波,马佳俊,黄亚文,杨军校.双螺环季戊四醇二膦酸酯环氧树脂的制备,表征及其耐热性能研究[J].化工新型材料,2012,40(1):49-52,104. |
| |
| 作者姓名： | 隋海波 马佳俊 黄亚文 杨军校 |
| |
| 作者单位： | 西南科技大学四川省非金属复合与功能材料重点实验室-省部共建国家重点实验室培育基地,绵阳,621010 |
| |
| 基金项目： | 国家自然科学基金-联合基金，四川省青年科技基金，绵阳市应用基础研究项目 |
| |
| 摘 要： | 三氯氧磷和季戊四醇反应得到的双螺环季戊四醇二膦酸酯二氯经与二烯丙基胺反应,再用mCPBA进行环氧化可得一种新型含双螺环季戊四醇二膦酸酯型环氧树脂(SPDPCDAAEP),采用红外光谱、核磁氢谱对环氧树脂的结构 进行了表征.同时用示差扫描量热分析(DSC)对SPDPCDAAEP/间苯二胺体系的非等温固化动力学的研究结果表明,SPDPCDAAEP在较低的温度下即可发生固化,且固化所需的活化能为64.47kJ/mol.最后将SPDPCDAAEP作为一种反应型阻燃剂应用于双酚A缩水甘油醚( DEGBA)的阻燃改性,热失重分析(TGA)数据显示SPDPCDAAEP/DEGBA复合材料在500℃、600℃及700℃的成碳率随着SPDPCDAAEP的添加量的增加而提高.尤其当SPDPCDAAEP所占的质量分数为40％时,温度为500℃的成碳率达到了56.9％,而温度为700℃的成碳率也达到了42.2％.
|
| 关 键 词： | 双螺环结构 环氧树脂 耐热性能 非等温固化 |
Preparation, characterization and heat resisting property of epoxy resin with bispirocyclic pentaerythritol diphosphate |
| |
| Sui Haibo
,
Ma Jiajun
,
Huang Yawen
,
Yang Junxiao.Preparation, characterization and heat resisting property of epoxy resin with bispirocyclic pentaerythritol diphosphate[J].New Chemical Materials,2012,40(1):49-52,104. |
| |
| Authors: | Sui Haibo Ma Jiajun Huang Yawen Yang Junxiao |
| |
| Affiliation: | Sui Haibo Ma Jiajun Huang Yawen Yang Junxiao(State Key Laboratory Cultivation Base for Nonmetal Composite and Functional Materials,Southwest University of Science and Technology,Mianyang 621010) |
| |
| Abstract: | Bispirocyclic pentaerythritol di(phosphatemonochloride)(SPDPC) was prepared by the reaction of phosphorus oxychloride and pentaerythritolm,which reacted with diallylamine to afford a new compound with bispirocyclic pentaerythritol diphosphate and terminal double bond(SPDPCDAA).Then it was epoxidized by using m-chloroperoxybenzoic acid(mCPBA) as oxidant to produce a novel epoxy resin(SPDPCDAAEP).The chemical structure of SPDPC,SPDPCDAA and SPDPCDAAEP were characterized by FT-IR and 1H-NMR spectra.In addition,compositions of the new epoxy resin(SPDPCDAAEP) with m-phenylene diamine,were used for investigation of its curing reactivity,heat,and heat resisting property with that of bispheno1-A type epoxy resin(DEGBA).The reactivities were measured by differential scanning calorimetry(DSC).The evaluation of thermal gravimetric analysis(TGA) showed that the polymers which were obtained through the curing reactions between the new epoxy resin,DEGBA and the curing agent exhibited excellent thermal stability as well as a high char yield. |
| |
| Keywords: | bispirocyclic structure epoxy resin heat resisting property non-isothermal curing |
| 本文献已被 CNKI 万方数据 等数据库收录！ |
|
