| 跌落仿真技术的现状及发展趋势 |
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| 引用本文： | 冯权和,彭必友,李善强,查五生.跌落仿真技术的现状及发展趋势[J].中国材料科技与设备,2009,6(4):7-9. |
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| 作者姓名： | 冯权和 彭必友 李善强 查五生 |
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| 作者单位： | 西华大学材料科学与工程学院,四川成都610039 |
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| 基金项目： | 基金项目：校人才引进基金项目（R0820103） |
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| 摘 要： | 跌落仿真技术可以快速、准确地模拟出电子产品结构整体受力和变形情况及相关数据，通过改变外观形状，优化注塑工艺参数等来达到提高产品质量的目的，弥补了传统的实物跌落测试的不足。本文概述了跌落仿真技术的原理及特点、发展现状以及目前存在的缺点．并指出了其发展趋势。
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| 关 键 词： | 注塑成型 电子产品 跌落仿真 有限元 CAE |
The Status and Development Trend of Drop Simulation Technology |
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| FENG Quan-he,PENG Bi-you,LI Shan-qiang,ZHA Wu-sheng.The Status and Development Trend of Drop Simulation Technology[J].Chinese Materials Science Technology & Equipment,2009,6(4):7-9. |
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| Authors: | FENG Quan-he PENG Bi-you LI Shan-qiang ZHA Wu-sheng |
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| Affiliation: | (College of Material Science and Engineering, Xihua University, Sichuan, Chengdu, 610039, China) |
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| Abstract: | Drop simulation technology can simulate the whole structure force, deformation, and related data of electronic products quickly and accurately. By changing the shape and optimizing the injection molding process parameters, the quality of products will be improved. Drop simulation has make up the limitation of traditional physical drop test. The principle and characteristics, development actuality and the current shortcomings of Drop simulation technology had summarized in this article, and the development trend of it had be indicated. |
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| Keywords: | Injection molding Electronic products Drop Simulation FEA CAEP |
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