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硅烷偶联剂KH550对Parylene C膜与金属铝基体结合强度的影响
引用本文:吉祥波,鲜晓斌,唐贤臣,帅茂兵.硅烷偶联剂KH550对Parylene C膜与金属铝基体结合强度的影响[J].高分子材料科学与工程,2012(3):57-59.
作者姓名:吉祥波  鲜晓斌  唐贤臣  帅茂兵
作者单位:中国工程物理研究院
摘    要:采用拉开法分析了KH550(γ-氨丙基三乙氧基硅烷)偶联剂浓度对Parylene C膜与金属铝基体间结合强度的影响,采用拉曼光谱(Raman)和红外光谱(FT-IR)分析了偶联剂在膜和基体间的作用机理。研究结果表明,使用10%的KH550偶联剂可提高Parylene C膜与铝基体的结合强度到7.5MPa。其增强作用机理为KH550偶联剂的烷氧基团水解后,-Si-OH与基体的Al-O键发生化学作用生成-Si-O-Al键,-NH2能与Parylene C膜分子间形成氢键,从而使Parylene C膜与金属铝之间产生化学键桥连。

关 键 词:Parylene  C  硅烷偶联剂  结合强度

Influence of KH550 Silane Coupling Agents on Adhesive Properties of Parylene C Film to Aluminum Substrates
Xiangbo Ji,Xiaobin Xian,Xianchen Tang,Maobing Shuai.Influence of KH550 Silane Coupling Agents on Adhesive Properties of Parylene C Film to Aluminum Substrates[J].Polymer Materials Science & Engineering,2012(3):57-59.
Authors:Xiangbo Ji  Xiaobin Xian  Xianchen Tang  Maobing Shuai
Affiliation:(China Academy of Engineering Physics,Mianyang 621900,China)
Abstract:Gama-amino-propyl-triethoxy-silane(named as KH550) was used as the surface treatment agent to improve the bonding strength of Poly(2-chloro-para-xylylene)(known as Parylene C) thin film to aluminium substrate.The effect on improving the bonding strength of Parylene C film to aluminium substrate surface was investigated.The mechanism was proposed by analyzing the chemical structures of the KH550 between aluminium substrate and Parylene C film.It is found that bonding strength of Parylene C film to the aluminium substrate is improved to 7.5MPa after surface treatment with 10% KH550 silane solution,due to the interaction of the silanol group with the aluminium oxide and the formation of the hydrogen bonds between-NH2 in KH550 and Cl-C-in Parylene C film.
Keywords:Parylene C  gama-propyl-triethoxy silane  bonding strength
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