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导热高分子材料的研究与应用
引用本文:储九荣,张晓辉,徐传骧.导热高分子材料的研究与应用[J].高分子材料科学与工程,2000,16(4):17-21.
作者姓名:储九荣  张晓辉  徐传骧
作者单位:西安交通大学电气工程学院电气绝缘研究所,陕西,西安,710049
摘    要:介绍了金属材料、非金属材料、高分子材料的导热机理,以及导热填料搀杂高分子材料的导热理论模型。综述了各种高导热填料的研究进展和它们在导热高分子材料中的应用情况。最后提出了导热高分子材料的研究方向。

关 键 词:导热高分子材料  导热机理  导热填料
修稿时间:1999-03-23

RESEARCH AND APPLICATIONS OF THERMAL CONDUCTING POLYMER
CHU Jiu-rong,ZHANG Xiao-hui,XU Chuang-xiang.RESEARCH AND APPLICATIONS OF THERMAL CONDUCTING POLYMER[J].Polymer Materials Science & Engineering,2000,16(4):17-21.
Authors:CHU Jiu-rong  ZHANG Xiao-hui  XU Chuang-xiang
Abstract:Thermal conductivity of polymers is general worse than metals and some metallic oxides or graphite. Commonly thermal conducting polymeric materials with good comprehensive properties is attained by mixing fillers, which have high thermal conductivity. They have well application prospects in the fields of power, electronics industry and so on. Thermal conducting mechanism of metals, non metals and polymers, and theoretical models of thermal conducting polymeric materials mixed with high thermal conducting fillers were introduced. Also research developments on high thermal conducting fillers and their applications in thermal conducting polymeric materials were summarized. At last, the research directions of thermal conducting polymeric materials were raised.
Keywords:thermal conducting polymers  thermal conducting mechanism  thermal conducting fillers  applications
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