| Sb,Bi 元素对 Sn-22 Sb 高温钎料合金组织的影响 |
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| 引用本文： | 甘树德,甘贵生,王涛,杜长华,李宏博.Sb,Bi 元素对 Sn-22 Sb 高温钎料合金组织的影响[J].精密成形工程,2014,6(3):50-53,63. |
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| 作者姓名： | 甘树德 甘贵生 王涛 杜长华 李宏博 |
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| 作者单位： | 重庆理工大学 材料科学与工程学院, 重庆 400054;重庆理工大学 材料科学与工程学院, 重庆 400054;长江师范学院 机械与电器工程学院, 重庆 408100;重庆理工大学 材料科学与工程学院, 重庆 400054;攀枝花材料工程学院, 四川 攀枝花 617000 |
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| 基金项目： | 重庆市教委 / 科技研究一般项目( KJ130813) ;重庆理工大学科研启动基金(2012ZD12) |
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| 摘 要： | 目的研究Sb和Bi元素对Sn-22Sb钎料显微组织的影响。方法制备了(Sn-22Sb)-xBi和Sn-xSb钎料合金,并分别采用差热分析和X射线衍射仪,分析了材料的熔化特征和物相。结果结果表明:Sn-22Sb钎料合金主要由灰色的β-Sn和白色块状的Sb2Sn3构成;少量的Bi使得Sn-22Sb钎料合金中Sb2Sn3金属间化合物逐渐细化和均匀化,数量却急剧增加;大量添加Sb后,使得Sn-22Sb钎料合金几乎全部变为粗大的块状β-SnSb组织,钎料合金的开始熔化温度有所提高。结论通过添加其他合金元素,降低Sn-50Sb钎料液相线温度,使其有望应用于二次回流焊。
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| 关 键 词： | 高温钎料 Sn-22Sb 组织 熔化温度 |
| 收稿时间： | 3/4/2014 12:00:00 AM |
| 修稿时间： | 5/1/2014 12:00:00 AM |
Effects of Sb and Bi on the Microstructure of Sn-22 Sb Solder Alloy |
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| GAN Shu-de,GAN Gui-sheng,WANG Tao,DU Chang-hua and LI Hong-bo.Effects of Sb and Bi on the Microstructure of Sn-22 Sb Solder Alloy[J].Journal of Netshape Forming Engineering,2014,6(3):50-53,63. |
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| Authors: | GAN Shu-de GAN Gui-sheng WANG Tao DU Chang-hua and LI Hong-bo |
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| Affiliation: | School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;College of Mechanical and Electrical Engineering, Yangtze Normal University, Chongqing 408100, China;School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China;Material Engineering College of Panzhihua University, Panzhihua 617000, China |
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| Abstract: | Objective To investigate the effects of Sb and Bi on the microstructure of Sn-22Sb Solder alloy. Methods （Sn-22Sb）-xBi and Sn-xSb solder alloys were prepared. The melting behavior and phase were analyzed by differential scanning calorimetry （DSC） and X-ray diffraction （XRD）, respectively. Results Sn-22Sb solder alloy was mainly composed of gray 13-Sn and white block Sb2Sn3. A small amount of Bi made the microstructure of Sb2Sn3 intermetallic compound in Sn-22Sb solder alloy fine and homogenized. Thick massive β-SnSb could be found in Sn-50Sb solder alloy, and the initial melting temperature of Sn-50Sb solder alloy increased. Conclusion The liquidus temperature of the Sn-50Sb solder was reduced by adding other alloying elements, leading to possible application in secondary reflow soldering. |
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| Keywords: | high-temperature solder Sn-22Sb microstructure melting temperature |
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