| 低银Sn-0. 45Ag-0. 68Cu-X 无铅钎料性能的对比研究 |
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| 引用本文： | 罗虎,甘贵生,王怀山,孟国奇,王青萌.低银Sn-0. 45Ag-0. 68Cu-X 无铅钎料性能的对比研究[J].精密成形工程,2015,7(2):51-54,65. |
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| 作者姓名： | 罗虎 甘贵生 王怀山 孟国奇 王青萌 |
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| 作者单位： | 重庆理工大学 材料科学与工程学院,重庆,400054 |
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| 基金项目： | 重庆理工大学研究生创新基金，重庆理工大学科研启动基金，重庆市教委/科技研究一般项目 |
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| 摘 要： | 目的制备一种新型低银亚共晶Sn-0.45Ag-0.68Cu-X(SAC-X)无铅钎料,并对其综合性能进行探究。方法参照国家标准,对其漫流性、润湿性及力学性能进行了测试,并与Sn-37Pb,Sn-0.7Cu,Sn-3.5Ag-0.6Cu钎料进行了对比。结果 4种钎料漫流性和润湿性大小依次为:Sn-37Pb,Sn-3.5Ag-0.6Cu,SAC-X,Sn-0.7Cu,其中SAC-X钎料铺展率达78.5%,润湿时间为1.3 s,最大润湿力为3.18 m N;SAC-X钎料抗拉强度(40 MPa)与高银Sn-3.5Ag-0.6Cu钎料(44 MPa)相差不大,但延伸率是高银Sn-3.5Ag-0.6Cu的1.89倍。结论低银SAC-X钎料综合性能优良,与Sn-3.5Ag-0.6Cu钎料相差不大。
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| 关 键 词： | 低银SAC-X钎料 漫流性 润湿性 力学性能 |
| 收稿时间： | 2015/1/12 0:00:00 |
| 修稿时间： | 2015/3/10 0:00:00 |
Comparative Experimental Study on Performance of Low-silver Sn-0. 45Ag-0. 68Cu-X Lead-free Solder |
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| LUO Hu,GAN Gui-sheng,WANG Huai-shan,MENG Guo-qi and WANG Qing-meng.Comparative Experimental Study on Performance of Low-silver Sn-0. 45Ag-0. 68Cu-X Lead-free Solder[J].Journal of Netshape Forming Engineering,2015,7(2):51-54,65. |
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| Authors: | LUO Hu GAN Gui-sheng WANG Huai-shan MENG Guo-qi and WANG Qing-meng |
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| Affiliation: | School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China,School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China,School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China,School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China and School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China |
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| Abstract: | A new type of low-silver hypoeutectic Sn-0. 45Ag-0. 68Cu-X (SAC-X) lead-free solder was prepared to investigate its integrated performance. The flowing property, wettability and mechanical properties of the new type of solder were tested according to the national standards, and compared with those of Sn-37Pb, Sn-0. 7Cu and Sn-3. 5Ag-0. 6Cu solders. The flowing ability and the wettability of the four typical solders both followed the order of Sn-37Pb, Sn-3. 5Ag-0. 6Cu, SAC-X and Sn-0. 7Cu. The spreading rate of SAC-X solder reached 78. 5%, the wetting time was 1. 3 s, and the maximum wetting force was 3. 18 mN. The tensile strength of SAC-X solder (40 MPa) was close to that of Sn-3. 5Ag-0. 6Cu solder (44 MPa), but its elongation rate was 1. 89 times that of Sn-3. 5Ag-0. 6Cu solder. Low-silver SAC-X solder had good comprehensive performance, which was close to that of Sn-3. 5Ag-0. 6Cu solder. |
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| Keywords: | low-silver SAC-X solder flowing property wettability mechanical properties |
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