| 环氧树脂-固化剂混合液体与铜基材料的润湿性能研究 |
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| 引用本文： | 肖锋,廖伟,陶鑫,刘兰霄,杨仁辉,傅亚.环氧树脂-固化剂混合液体与铜基材料的润湿性能研究[J].功能材料,2007,38(8):1244-1246. |
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| 作者姓名： | 肖锋 廖伟 陶鑫 刘兰霄 杨仁辉 傅亚 |
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| 作者单位： | 1. 重庆工学院,材料界面物理化学研究所,重庆,400050
2. 重庆科技学院,化学系,重庆,400042 |
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| 基金项目： | 教育部留学回国人员科研启动基金
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重庆市自然科学基金
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重庆市人事局资助项目 |
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| 摘 要： | 采用静滴法观察了液态纯固化剂和20%树脂-80%固化剂混合液体与铜基材料的润湿行为,测定了298～363K温度范围内的接触角,评价了两种液体与铜基材料的润湿性.结果表明,接触角随时间呈下降趋势,初始接触角随着试样中环氧树脂比例的增加而降低,温度对固化剂平衡接触角的影响较小.在同样的温度条件下,加入树脂后的液体的平衡接触角小于纯固化剂的平衡接触角.
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| 关 键 词： | 环氧树脂 铜 接触角 润湿性 静滴法 |
| 文章编号： | 1001-9731（2007）08-1244-03 |
| 修稿时间： | 2007-02-082007-04-10 |
Wettability of liquid epoxy resin-curing agent with copper substrate |
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| XIAO Feng,LIAO Wei,TAO Xin,LIU Lan-xiao,YANG Ren-hui,FU Ya.Wettability of liquid epoxy resin-curing agent with copper substrate[J].Journal of Functional Materials,2007,38(8):1244-1246. |
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| Authors: | XIAO Feng LIAO Wei TAO Xin LIU Lan-xiao YANG Ren-hui FU Ya |
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| Affiliation: | 1.Materials Interfacial Physical-Chemistry Research Institute,Chongqing Institute of Technology,Chongqing 400050,China; 2.Department of Chemistry,Chongqing Institute of Science and Technology,Chongqing 400042,China |
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| Abstract: | The wettability of liquid curing agent and 20% epoxy resin-80% curing agent with copper substrate were observed at 298-363K using a sessile drop method.The contact angle was measured,and the wettability between them was evaluated.The contact angle decreases with time elapsing in single experiment.The original contact angle tends to decrease with increasing epoxy resin content in a sample.The influence of temperature on equilibrium contact angle of curing agent is little.At a same temperature,the equilibrium contact angle of sample with epoxy resin is less than that of curing agent. |
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| Keywords: | epoxy resin copper contact angle wettability sessile drop method |
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