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半导体热电材料研究进展
引用本文:刘宏,王继扬.半导体热电材料研究进展[J].功能材料,2000,31(2):116-118.
作者姓名:刘宏  王继扬
作者单位:1. 山东大学晶体材料国家重点实验室,山东 济南250100;山东轻工业学院无机材料系,山东 济南250100
2. 山东轻工业学院无机材料系,山东 济南250100
摘    要:本文从讨论热电材料的性能出发 ,讨论了提高半导体热电性能的主要途径 ,介绍了主要的半导体热电材料特别是近年来的进展情况 ,展望了其应用前景 ,并提出了亟待解决的问题。

关 键 词:地导体热电材料  热电性  热电系数  热导率
文章编号:1001-9731(2000)02-0116-03
修稿时间:1998-12-28

Progress of Semiconductor Thermoelectric Materials
LIU Hong,WANG Jiyang.Progress of Semiconductor Thermoelectric Materials[J].Journal of Functional Materials,2000,31(2):116-118.
Authors:LIU Hong  WANG Jiyang
Affiliation:LIU Hong (State Key Lab of Crystal Materials, Shandong University, Ji'nan, 250100, China)WANG diyang (Department of Inorganic Materials, Shandong Institute of Light Industry,Ji'nan,250100,china)
Abstract:The effects of Seebeck coefficient,electric conductivity and thermal conductivity on the thermoelectricity of semiconductor materials was discussed.The approaches to improve thermoelectricity of materials were suggested.The main thermoelectric materials were introduced.The last progresses and the foreground of application of the materials were reviewed.The urgent problems for thermoelectric materials were raised.
Keywords:semiconductor thermoelectric material  thermoelectricity  Seebeck coefficient  thermal conductivity
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