烧结压力对石墨烯增强铜基复合材料组织性能的影响

烧结压力是粉末冶金制备材料过程中重要工艺参数之一,通过在石墨烯/铜中添加钛粉以改善二者润湿性,使用超声分散和球磨法进行混粉,用放电等离子烧结(SPS)的方式制备石墨烯铜基复合材料,在5,15,25,30MPa 4种不同压力下进行烧结。用金相显微镜和扫描电子显微镜(SEM)对石墨烯增强铜基复合材料显微结构进行观察,测量试样密度,并采用硬度计、导电率测试仪对力学性能和导电性能进行测试。结果表明,随着烧结压力的升高,复合材料晶粒尺寸不断减小,导电率先上升后下降。当烧结压力达到25 MPa时,导电率最大为51.2%IACS;复合材料的密度和硬度值不断增大。

Effect of sintering pressure on the microstructure and properties of graphene-reinforced copper matrix composites

Sintering pressure is one of the most important parameters in powder metallurgy process.The titanium powder was added in the graphene/copper.Ultrasonic dispersion and ball mill method was used for mixing powder, and then Spark Plasma Sintering method was used for preparation of graphene copper matrix composites with 5,15,25,30 MPa four different sintering pressure. Using metallographic microscope and scanning electron microscope (SEM) to observe the microstructure of graphene reinforced copper matrix composites. Measuring the density, the hardness and electrical conductivity of the sample. The results show that the grain size of the present composite gradually decreases, while conductivity first increases and then decreases with increasing sintering pressure. When the sintering pressure reaches 25 MPa, the maximum of the conductivity is 51.2%IACS. As the pressure ranges from 5 to 30 MPa, the density and hardness of the composite continually enhance, respectively.