热处理对立方织构Ni-5%(体积分数)W基带上Ag薄膜择优取向的影响

采用磁控溅射法在立方织构Ni-5%(原子分数,下同)W基底上沉积了Ag薄膜作为第二代高温超导带材--YBaCuO涂层导体的导电缓冲层,并通过后期在Ar气氛下热处理使Ag膜具有(200)择优取向.磁控溅射后Ag膜的择优取向为(111),随着热处理温度的升高,(200)择优取向强度增加.采用慢降温工艺即在900℃下恒温30min,然后以较慢的速率10℃/h降至800℃后样品随炉冷却,有利于Ag薄膜由(111)向(200)的择优生长转变.

Effects of heat treatment on the preferred orientation of Ag films on cube textured Ni-5at% W substrates

As conductive buffer of the second generation high temperature superconductor tapes--YBaCuO coated conductor,Ag films was heat treated in Ar atmosphere to grow in the (200) preferred orientation after magnetron sputtered on the cube textured Ni-5at%W substrates. The preferred orientation of magnetron sputtered Ag films was (111). With the heat treatment temperature increasing,the preferred orientation of (200) was intensified. When Ag films were treated with the slow-cooling process . i. e. heating up to 900℃, then cooling in the rate of 10℃/h down to 800℃ .finally furnace cooling,it is favorable for the transition of the preferred orientation of Ag film from (111) to (200).