| 金刚石—铜薄膜复合材料 |
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| 引用本文： | 董占民 K.,BC.金刚石—铜薄膜复合材料[J].功能材料,1999,30(4):375-376. |
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| 作者姓名： | 董占民 K. BC |
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| 作者单位： | [1]清华大学物理系 [2]基辅大学物理系 |
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| 摘 要： | 用ＣＶＤ法合成了金刚石－铜的复合材料。实验证明，合成金刚石－铜复合材料相对厚度的合适范围ｈ／Ｈ＝５－７。复合材料的热传导系数随合成温度Ｔ０的增高而增大。在Ｔ０＝１２４３Ｋ时α≤７００Ｗ·Ｍ＾－１·Ｋ＾－１，近似于高压人工合成的金刚石 。
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| 关 键 词： | 金刚石 铜 复合材料 热导系数 |
Diamond-Copper Composite Film |
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| DONG Zhanmin,Kopan V S Physics.Diamond-Copper Composite Film[J].Journal of Functional Materials,1999,30(4):375-376. |
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| Authors: | DONG Zhanmin Kopan V S Physics |
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| Affiliation: | DONG Zhanmin1,Kopan V S2 1 Physics Department,Tsinghua University,Beijing,100084,China,2 Physics Department,Kiev University,Kiev,252022,Ukran |
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| Abstract: | The diamond film on copper substrates is obtained by CVD method.The experiments have showed that the relative thickness h/H =57,at which the diamond-copper composite material is joined,is apposite.The thermal conductivity of the composite materials increases when the temperature T0 rises.At the temperature T0 =1243K,the thermal conductivity 700Wm-1K-1 nearly equals to that of artificial diamond produced under high pressure. |
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| Keywords: | diamond copper composite material thermal conductivity |
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