| 改善PCB高密度基板封装质量的研究 |
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| 引用本文： | 丁黎光,徐梦廓.改善PCB高密度基板封装质量的研究[J].包装工程,2009(11). |
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| 作者姓名： | 丁黎光 徐梦廓 |
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| 作者单位： | 广西工学院; |
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| 摘 要： | 高密度基板上的微孔质量对封装微电子器件十分重要,由于孔密度大,孔径又小,目前普遍采用激光打孔。针对基板的组成材料以及激光加工中主要参数对微孔加工的影响进行分析研究。通过不同材料粘结力和改变激光的功率、脉宽等措施,改善基板电子元器件封装的质量。
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| 关 键 词： | 基板微细孔 激光加工 封装质量 |
Investigation of Improving HD-PCB Substrate Packaging Quality |
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| DING Li-guang,XU Meng-kuo.Investigation of Improving HD-PCB Substrate Packaging Quality[J].Packaging Engineering,2009(11). |
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| Authors: | DING Li-guang XU Meng-kuo |
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| Affiliation: | DING Li-guang,XU Meng-kuo(Guangxi University of Technology,Liuzhou 545006,China) |
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| Abstract: | The quality of micro via on HD-substrate is important for packaged microelectronics component.Laser drill was generally used for small diameter and high density of the micro via.The influence of substrate material and the main parameters of laser processing on laser drill was analyzed and studied.The packaging quality of microelectronics components on substrate was improved through changing of adhesive power of different material,and tuning the power and pulse width of laser. |
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| Keywords: | micro via of substrate laser processing packaging quality |
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