| 树脂封装中湿气浸入和成形缺陷的研究 |
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| 引用本文： | 丁黎光,丁伟,吴德林.树脂封装中湿气浸入和成形缺陷的研究[J].包装工程,2006,27(3):72-73. |
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| 作者姓名： | 丁黎光 丁伟 吴德林 |
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| 作者单位： | 广西工学院,柳州,545006;重庆金映数控设备制造有限公司,重庆,401120 |
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| 摘 要： | 介绍了电子元件的封装技术.主要针对树脂封装进行研究,分析湿气浸入、成形缺陷及表现形式,并提出防止措施,以利于对我国的微型包装中的电子封装及微电子业有所促进.
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| 关 键 词： | 树脂封装 湿气和缺陷 防止 |
| 文章编号： | 1001-3563(2006)03-0072-02 |
| 收稿时间： | 2005-08-08 |
| 修稿时间： | 2006-04-24 |
Research on the Moisture and Defects in Resin Encapsulation |
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| DING Li-guang,DING Wei,WU De-ling.Research on the Moisture and Defects in Resin Encapsulation[J].Packaging Engineering,2006,27(3):72-73. |
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| Authors: | DING Li-guang DING Wei WU De-ling |
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| Affiliation: | 1. Guangxi University of Technology, Liuzhou 545006, China; 2. Chongqing Jinying N/C Equipment Inc, Chongqing 401120, China |
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| Abstract: | The encapsulation technique of electronic components was introduced. Aiming at resin encapsulation, the intrusion of moisture, the molding defects and forms of expression were analyzed. Some prevention measures were put forward to promote the electronic encapsulation in mini - packing and the micro - electronics industry in our country. |
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| Keywords: | resin encapsulation moisture defects prevention |
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