| Abstract: | A technique developed to self assemble solid colloidal particles under a sinusoidal electric field (AC field) is adapted to soft W/O/W double‐emulsion globules, and is exploited for surface patterning. Double‐emulsions containing cupric ions are prepared, placed between two planar ITO electrodes and submitted to a transversal AC field which induced their ordering into hexagonal 2D‐arrays. The characteristic spacing is monitored by varying the globule volume fraction. Such self‐assembly is used to fabricate copper‐depleted arrays, using globules as both a metal precursor reservoir/provider and as a mask. The ordered globule monolayer is then submitted to a DC field to induce metal precursor leakage and its reduction onto the electrode. The organized, oily and dielectric globules generate arrays of holes (c.a. 7 μm) into a thin copper deposit (thickness of 12 nm). Holes are shown to be formed below the globules, and their separation (from 10 to 30 μm) can be tuned as deduced from direct observations using optical and atomic force microscopy. |
