Properties of synthetic diamond and graphene nanoplatelet-filled epoxy thin film composites for electronic applications

Epoxy thin film composites filled with particulate nanofillers; synthetic diamond and graphene nanoplatelets were prepared and characterized based on tensile, thermal, and electrical properties. The influences of these two types of fillers, especially in terms of their loading, sizes and shapes, were discussed. It was found that the epoxy thin film composites incorporating synthetic diamond displayed optimum properties where the addition of synthetic diamond from 0 to 2 vol.% results in higher elastic modulus, tensile strength, elongation at break, thermal conductivity and storage modulus if compared to those of graphene nanoplatelets composites. Both thin film composites showed improvement in the glass transition temperature with increasing filler loadings. Results on the electrical conductivity of both systems showed that higher conductivity is observed in graphene nanoplatelets composites if compared to synthetic diamond composites.