Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board |
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Authors: | K C Yung H Liem H S Choy T M Yue |
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Affiliation: | (1) Department of Industrial and Systems Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong |
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Abstract: | Liquid crystal polymer (LCP) has attracted great attention as a potential candidate for high performance micro-wave substrate
material in high frequency printed circuit boards (PCB). This is attributed to its low loss behaviour, excellent thermal stability,
and outstanding chemical resistance. The use of LCP in PCB, however, is hindered by its extreme chemical inertness, causing
fabrication challenges in desmearing and metallization processes. To overcome the challenges, plasma etching is suggested
for its capability of smear removal, adhesion improvement and surface activation of PCB material. However, previous experimental
and theoretical studies of the effects of plasma etching on LCP PCB at different treatment conditions are lacking. This paper
thus evaluates recent developments on plasma etching technologies, involving the plasma etching investigation under different
process conditions for manufacturing LCP PCB. Distinct process approaches are developed and proposed based on the illustrations
of the experimental outcomes. Finally, examples are shown to demonstrate the effectiveness of the proposed plasma etching
approach for controlling the fabrication of LCP PCB. |
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