| 表面组装技术用焊锡粉末的制备 |
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| 引用本文： | 于喜良,赵麦群,张卫华,赵高扬.表面组装技术用焊锡粉末的制备[J].材料开发与应用,2003,18(4):30-31,35. |
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| 作者姓名： | 于喜良 赵麦群 张卫华 赵高扬 |
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| 作者单位： | 西安理工大学材料科学与工程学院,西安,710048 |
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| 基金项目： | 陕西省教委自然科学基金资助项目(0 2JK133) |
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| 摘 要： | 根据拉瓦尔喷管原理设计出一种新型低压超音速雾化器 ,用 6 3A焊锡和Sn Ag系无铅焊锡进行了雾化试验研究。试验结果表明 ,新型雾化器可获得微细的球形焊锡合金粉末 ,可以满足表面组装技术 (SMT)用焊锡粉的要求 ,焊锡熔化温度为 4 0 0～ 4 5 0℃ ,雾化压力为 0 .7～ 1.0MPa。影响微粉粒度形成的主要因素有合金过热度 ,雾化压力 ,雾化环境中的氧含量等
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| 关 键 词： | 拉瓦尔喷管 超音速雾化器 表面组装技术 焊锡合金粉末 |
| 文章编号： | 1003-1545(2003)04-0030-02 |
Study on the Preparation of Solder Powder in Surface Mounted Technology |
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| Yu Xiliang,Zhao Maiqun,Zhang Weihua,Zhao Gaoyang.Study on the Preparation of Solder Powder in Surface Mounted Technology[J].Development and Application of Materials,2003,18(4):30-31,35. |
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| Authors: | Yu Xiliang Zhao Maiqun Zhang Weihua Zhao Gaoyang |
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| Abstract: | A new type atomizer designed on the theory of Laval jet is tested in atomization experiment with 63A solder and Sn Ag lead free solder. The result indicates that the fine and ball shape solder alloy powder can be gotten by using the new atomizer with the melt temperature 400～450℃, the atomizing pressure 0.7～1.0MPa, meeting the requirement of surface mounted technology. It is found that the overtemperature of the solder alloy, atomizing pressure and oxygen content in atomizing environment are main factors to influence the particle size of the powder. |
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| Keywords: | Laval jet tube Supersonic atomizer Surface mounted technology Solder alloy powder |
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