Three-dimensional viscoelastic simulation of woven composite substrates for multilayer circuit boards |
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| Affiliation: | 1. Department of Aeronautical and Astronautical Engineering, University of Illinois at Urbana-Champaign, MC 236 306 Talbot Laboratory, 104 South Wright Street, Urbana, IL 61801, USA;2. Department of Theoretical and Applied Mechanics, University of Illinois at Urbana-Champaign, Urbana, IL 61801, USA;1. Department of Mechanical and Materials Engineering, National University of Malaysia (UKM), Bangi 43600, Malaysia;2. Department of Mechanical Engineering, National University of Singapore (NUS), Singapore 117576, Singapore;1. College of Civil Engineering, Nanjing Tech University, Nanjing, 211816, China;2. Key Laboratory of Concrete and Prestressed Concrete Structures of the Ministry of Education, Southeast University, Nanjing, 210096, China |
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| Abstract: | Viscoelastic properties of woven composite substrates are essential to design dimensionally stable multilayer printed circuit boards. Unlike most existing numerical work which rely on simplified constitutive (elastic) and geometrical models, this study involves a fully three-dimensional viscoelastic model of a plain weave composite with accurate characterization of the woven geometry. Comparisons between numerical predictions and experimental data clearly indicate that the creep compliance of the composite depends not only on the relaxation of the matrix, but also on the time-dependent flexural deformations of the woven fabric bundles. Predictions of the inhomogeneous deformation fields over the repeating cell agree with experimental observations. |
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