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The influence of hygrothermal conditions on the damage processes in quasi-isotropic carbon/epoxy laminates
Authors:K Ogi  H S Kim  T Maruyama  Y Takao
Affiliation:

a Research Institute for Applied Mechanics, Kyushu University, 6-1 Kasuga-Koen, Kasuga-city, Fukuoka 816-8580, Japan

b Department of Aeronautics and Astronautics, Graduate School of Engineering, Kyushu University, 6-10-1 Hakozaki, Higashi-ku, Fukuoka 812-8581, Japan

Abstract:The effects of hygrothermal conditions on damage development in quasi-isotropic carbon-fiber/epoxy laminates are described. First, monotonic and loading/unloading tensile tests were conducted on dry and wet specimens at ambient and high temperatures to compare the stress/strain response and damage development. The changes in the Young's modulus and Poisson's ratio were obtained experimentally from the monotonic tensile tests. The critical stresses for transverse cracking and delamination for the above three conditions are compared. The delamination area is measured by using scanning acoustic microscopy (SAM) at various loads to discuss the effects of delamination on the nonlinear stress/strain behavior. Next, the stress distributions under tensile load including hygrothermal residual stresses are computed by a finite-element code and their effects on damage initiation are discussed. Finally, a simple model for the prediction of the Young's modulus of a delaminated specimen is proposed. It is found that moisture increases the critical stresses for transverse cracking and delamination by reducing the residual stresses while high temperature decreases the critical stresses in spite of relaxation of the residual stresses. The results of the finite-element analysis provide some explanations for the onset of transverse cracking and delamination. The Young's modulus predicted by the present model agrees with experimental results better than that predicted by conventional models.
Keywords:B  Hygrothermal effect  B  Matrix cracking  C  Delamination  C  Finite-element analysis  C  Residual stress
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