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热物理性质测试技术研究现状和发展趋势
引用本文:奚同庚,谢华清.热物理性质测试技术研究现状和发展趋势[J].上海计量测试,2002,29(5):7-12.
作者姓名:奚同庚  谢华清
作者单位:中国科学院上海硅酸盐研究所无机材料分析测试中心,200050
摘    要:本文在对热物理性质研究在热能工程、材料科学、信息科学、航天工程、环境工程、生物科学、微电子技术和计量学等众多科技领域中的重要性进行探讨的基础上,评述了热物理性质测试技术的研究现状和发展趋势。鉴于薄膜材料在微电子器件、集成电路和微电子机械系统等领域中日益广泛的应用,本文还综述了亚微米-纳米尺度薄膜材料热导率和热扩散率的测试新技术。

关 键 词:研究现状  发展趋势  热物理性质  测试技术  薄膜材料  纳米薄膜  热导率  热扩散率  物质

The Research Progress and Development Tendency of the Measuring Technique on the Thermophysical Properties
Xi Tonggeng,Xie Huaqing.The Research Progress and Development Tendency of the Measuring Technique on the Thermophysical Properties[J].Shanghai Meassurement and Testing,2002,29(5):7-12.
Authors:Xi Tonggeng  Xie Huaqing
Abstract:The importance of the research on the thermophysical properties of matter to sciences and technologies in various fields, such as thermal engineering, material science, information technology, aerospace engineering, environmental science, biological science, microelectronic technique, metrological science and related technologies are discussed. The current situation and new development tendency of the experimental method on the thermophysical properties are reviewed. The thin film materials have been widely applied to microelectronic devices, microelectromechanical systems and integrated circuits, so this paper also describes the new measuring techniques on the thermal conductivity and thermal diffusivity of sub-micrometer-nanometer scale thin film materials.
Keywords:Thermophysical properties  Measuring technique
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