首页 | 本学科首页   官方微博 | 高级检索  
     


Multiple Scattering of Thermal Waves from a Subsurface Cylindrical Inclusion in Semi-infinite Functionally Graded Materials Using Non-Fourier Model
Authors:Xue-Qian Fang  Shu-Min Duan  Shu-Hong Liu  Xiao-Hua Wang and Wen-Jie Feng
Affiliation:(1) Department of Engineering Mechanics, Shijiazhuang Railway Institute, Shijiazhuang, 050043, China;(2) Computer and Information Engineering Department, Shijiazhuang Railway Institute, Shijiazhuang, 050043, China
Abstract:In this study, a theoretical method is applied to investigate the multiple scattering of thermal waves and temperature field resulting from a subsurface cylindrical inclusion in a semi-infinite functionally graded material (FGM). The adiabatic boundary condition at the semi-infinite surface is considered. The thermal waves are excited at the surface of semi-infinite functionally graded materials by modulated optical beams. The model includes the multiple scattering effects of the cylindrical thermal wave generated by the line heat source. According to the wave equation of heat conduction, a general solution of scattered thermal waves is presented. Numerical calculations illustrate the effect of subsurface inclusion on the temperature and phase change at the sample surface under different physical and geometrical parameters. It is found that the temperature above the conducting cylindrical inclusion decreases because of the existence of the inclusion. The effect of the inclusion on the temperature and phase change at the surface is also related to the non-homogeneous parameter of FGMs, the wave frequency of thermal waves, and the distance between the inclusion and the semi-infinite surface. Finally, the effect of the relaxation time of buried inclusion on the temperature and phase change at the surface is examined.
Keywords:Cylindrical inclusion  Multiple scattering of thermal waves  Non-Fourier heat conduction law  Semi-infinite functionally graded materials
本文献已被 SpringerLink 等数据库收录!
设为首页 | 免责声明 | 关于勤云 | 加入收藏

Copyright©北京勤云科技发展有限公司  京ICP备09084417号