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高体积分数SiCp/Al复合材料的微观组织与导热性能
引用本文:张强,武高辉,孙东立,韩杰才.高体积分数SiCp/Al复合材料的微观组织与导热性能[J].材料科学与工艺,2006,14(5):474-477.
作者姓名:张强  武高辉  孙东立  韩杰才
作者单位:1. 哈尔滨工业大学,材料科学与工程学院,黑龙江,哈尔滨,150001
2. 哈尔滨工业大学,复合材料研究所,黑龙江,哈尔滨,150001
摘    要:选用两种粒径的SiC颗粒,采用挤压铸造方法制备了体积分数为70%的SiCp/LD11(Al-12%Si)复合材料,研究了材料的微观组织和导热性能.研究表明:复合材料组织均匀、致密;SiC—Al界面干净,而基体中的Si相分别存在从铝中直接析出和依附SiC颗粒表面生长这两种分布形态;复合材料导热性能优异,其导热率大于基体LD11铝合金的导热率.

关 键 词:铝基复合材料  微观组织  导热
文章编号:1005-0299(2006)05-0474-04
收稿时间:2004-10-15
修稿时间:2004年10月15

Microstructure and thermal conduction property of SiCp/Al- Si composite with high reinforcement content
ZHANG Qiang,WU Gao-hui,SUN Dong-li,HAN Jie-cai.Microstructure and thermal conduction property of SiCp/Al- Si composite with high reinforcement content[J].Materials Science and Technology,2006,14(5):474-477.
Authors:ZHANG Qiang  WU Gao-hui  SUN Dong-li  HAN Jie-cai
Affiliation:1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China,2. Centes for Composite Materials, Harbin Institute of Technology, Harbin150001, China
Abstract:With dual sized SiC particles,a 70vol.% SiCp/LD11(Al-12%Si) composite was fabricated by squeeze casting technology,and its microstructure and thermal conduction property were investigated.The results showed that the composite had an uniform and dense microstructure and was free from interfacial reaction products. Two kinds of silicon phases were found.One precipitated in aluminum matrix and the other nucleated on the surface of SiC particles.The composites possessed excellent thermal conductivity and its value was higher than that of LD11 matrix.
Keywords:SiC
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